Equipment We Manufacture
Three product lines — wire saws, grinding machines, and 5-axis bridge saws.
Diamond wire cutting systems for precision slab slicing.
Precision grinding for flatness and surface finish.
Multi-axis CNC bridge cutting for complex profiles.
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Quartz Glass Processing Capabilities by Material & Method
Verified machining parameters for JGS1 UV-Grade, JGS2 Optical, JGS3 IR-Grade, and GE214 Standard fused silica across CNC machining, wire sawing, grinding, polishing, and laser drilling.
| Process | JGS1 UV-Grade | JGS2 Optical | JGS3 IR-Grade | GE214 Standard |
| CNC 5-Axis Machining | Capable: ±1μm, Ra 0.002μm, Max Φ400mm | Capable: ±2μm, Ra 0.005μm, Max Φ400mm | Capable: ±5μm, Ra 0.01μm, Max Φ400mm | Capable: ±10μm, Ra 0.02μm, Max Φ500mm |
| Diamond Wire Saw | Capable: Kerf 0.15mm, Flatness 5μm | Capable: Kerf 0.18mm, Flatness 8μm | Eval: Under evaluation | Capable: Kerf 0.20mm, Flatness 15μm |
| Surface Grinding | Capable: Flatness 1μm, Parallelism 1μm | Capable: Flatness 2μm, Parallelism 2μm | Capable: Flatness 3μm, Parallelism 3μm | Capable: Flatness 5μm, Parallelism 5μm |
| Cylindrical Grinding | Capable: Roundness 0.5μm, Ra 0.002μm | Capable: Roundness 1μm, Ra 0.005μm | Eval: Under evaluation | Capable: Roundness 2μm, Ra 0.01μm |
| Optical Polishing | Capable: Ra ≤0.05nm, λ/20, 185nm+ | Capable: Ra ≤0.1nm, λ/10, 200nm+ | N/A: Not applicable for IR-grade | Capable: Ra ≤0.5nm, λ/4, 220nm+ |
| Laser Drilling | Capable: Φ50μm, ±2μm, 10:1 aspect | Capable: Φ80μm, ±3μm, 8:1 aspect | Eval: Under evaluation | N/A: Not applicable |
Parameters are verified production values. JGS1/2/3 per GB/T 31447.1 standard. Request a Custom Process Plan via WhatsApp.
Verified Processing Record
Documented production records for semiconductor diffusion tubes, photovoltaic crucibles, and UV-grade optical windows with full traceability.
Semiconductor project QZ-SEMI-2024, China. JGS1 material. OD 320mm, Tolerance ±0.3mm, Surface Ra 0.01μm, Purity 99.995%, Quantity 12.
Photovoltaic project QZ-PV-2023, China. High-purity fused silica. Diameter 28 inches, Purity 99.99%, Surface Ra 0.05μm, Wall thickness 15mm, Quantity 45.
Optical project QZ-OPT-2024, Germany-bound. JGS1 UV-grade. Transmission 185-2500nm, Flatness λ/20, Surface Ra ≤0.05nm, Diameter 150mm, Quantity 8.
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Precision Machining Equipment
Core machining equipment specifications and parameters.
- Positioning accuracy: ±1μm
- Spindle speed: 60,000 RPM
- Work envelope: 600×400×300mm
- Tooling: Diamond-coated carbide
- Axis count: 5-axis simultaneous
- Repeatability: ±0.5μm
- Surface roughness: Ra 0.002μm
- Max workpiece: Φ400mm
Control system: Siemens 840D sl. Linear axes: X600 / Y400 / Z300 mm. Rotary axes: A±120° / C±360°. Feed rate (rapid): 0–60 m/min. Feed rate (cutting): 0–10 m/min. Tool magazine: 120 stations (HSK-E40).
Wire diameter: 0.15–0.20 mm. Wire speed: 10–14 m/s. Feed rate: 0.08–0.15 mm/min. Diamond grit: 4–6 μm. Max workpiece: 500×500×300 mm. Kerf loss: 0.15–0.20 mm.
Grinding wheel: Diamond resin-bonded. Wheel speed: 20–30 m/s. Depth per pass: 5–20 μm. Flatness (Φ300mm): 1 μm. Parallelism: 1 μm. Surface roughness: Ra 0.002 μm.
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Quality & Regulatory Credentials
Our quality system certifications and regulatory compliance credentials.
Scale, Network & Proven Partnerships
Manufacturing scale, reference clients, and global service network.
Reference Clients
Selected reference clients. Full list under NDA.
Service Network
- Quanzhou — HQ & Manufacturing (UTC+8)
- Quanzhou — Engineering Centre (UTC+8)
- Quanzhou — South China Service (UTC+8)
- Quanzhou — Southwest Service (UTC+8)
Overseas agents cover Europe (DE/IT), Southeast Asia (VN/ID), and the Middle East (UAE/SA).
How CNC Diamond Machining Compares
| Dimension | CNC Diamond Machining | Flame Working | Conventional Grinding | Abrasive Water Jet |
| Tolerance | ±1μm | ±0.5mm | ±5μm | ±0.1mm |
| Surface Finish | Ra 0.002μm | Ra 0.1μm | Ra 0.01μm | Ra 0.5μm |
| Subsurface Damage | Minimal | High (thermal) | Moderate | Moderate |
| Complex Geometry | Full 5-axis | Limited | Limited | Limited |
| Material Purity Impact | None | Contamination risk | None | None |
| Repeatability | High (CNC) | Operator-dependent | Medium | Medium |